Statement: Articles reproduced or quoted on this site involve copyright issues, please contact the webmaster to handle.Updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry.This is a must-have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies.IPC-A-610 is developed in synergy with J-STD-001, and for the first time with this revision, IPCWHMA-A-620.
This product includes one poster, for Class 3. Also available in a Class 2 version, part number: P-PTH2-G). The addendum MUST be used with the same version of the standard; e.g. CS with 001C, 001DS with 001D, 001ES with 001E. Nonfunctional Land A land that is not connected electrically to the conductive pattern on its layer. Class 2 Product Dedicated Service Electronic Product - Continued performance and extended life required. Class 3 Product High Performance Electrical Product - Continued high performance or performance-on-demand is critical. Equipment might be used for life-support or other critical systems. Who as the ultimate responsibility for identifying the class to which the assembly is evaluated The Customer. Shall Invokes a requirement for manufacturers of all classes or product, and failure to comply with the requirement is a noncompliance to this standard. Procurement as agreed and documented between customer and supplier. Order of Precedence in event of conflict 2 Master drawing or master ass. Order of Precedence in event of conflict 3 IPC-1-610 when invoked by the customer or contract. If documents other than IPC-A-610 are cited, the order of precedence shall be defined in the Procurement documents Target Condition A condition that is close to perfect, but is not always achievable and may not be necessary to ensure the reliability of the assembly. Acceptable Condition A condition that, while not necessarily perfect, will maintain integrity and reliability of the assembly Defect Condition The form, fit or function of the assembly is inadequate for use in its end use environment. Disposition The determination of how defects should be treated. Who dispositions defect conditions The manufacturer, based on design, service and customer requirements. Process Indicator Conditions A condition (not a defect) that does not affect the form, fit or function of a product. Conditions Not Specified A condition that is neither a defect, nor a process indicator. A condition not specified may be considered acceptable unless it can be established that the condition affects user-defined form, fit or function. Primary Side The side of a packaging or interconnecting structure (PCB) defined as primary on the master drawing. Solder source side The side of the PCB to which solder is applied. This is usually the secondary side, but might be the primary side in some cases. Solder Destination Side The side of the PCB that the solder flows toward in through-hole technology. The destination is is normally the primary side of the PCB, but might be the secondary side in some cases. Cold Solder Connection A solder connection that exhibits poor wetting and that is characterized by a grayish porous appearance. What can cause a cold solder connection Excessive impurities in the solder, inadequate cleaning prior to the soldering, andor insufficient application of heat during the soldering process. Meniscus (component) Sealant or encapsulant on a lead, protruding from the seating plane of the component. This includes ceramic, epoxy or other composites, and flash from molded components.
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